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Fu Wing Interconnect Technology — supplier / exporter profile · BoatDB
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Bills of lading
Fu Wing Interconnect Technology
Supplier / exporter
Fu Wing Interconnect Technology
Last shipment 24 Mar 2026
1 shipments
Hong Kong
1
Total shipments
1
Top US buyers
Largest US importers this supplier ships to.
24 Mar 2026
Last arrival
Top buyers
US importers they ship to
Wistron Infocomm Technology Americ Corp
1 shipments
Products shipped
what they export
Zinc
· HS 79
1
Latest shipments
most recent bills of lading
Arrival
Importer
Product
Weight
B/L
24 Mar 2026
Wistron Infocomm Technology Americ Corp
lga sp socket for microsoft(vn) amd sp srm+ dust cover pantone c sp blackplate sp (.mm)
861 kg
KWEO520047319782
Hong Kong